PURPOSE: To obtain a multilayered line structure which has improved characteristics and improve reliability of connection by shifting the lead-out positions of through hole conductors from each other, and adhering conductor plates which overlaps with each other in a prescribed section between said lead-out positions and in the same plane with an external conductor surface.

CONSTITUTION: When multilayered triplet lines each consisting of an external conductor plate 1, a dielectric substrate 2, and an internal conductor plate 3 are connected mutually by through hole conductors 4a and 4b, the through hole conductor 4b is shifted in position from the through hole conductor 4a, and conductor plate 5 are formed between them while overlapping with each other in a prescribed section. The conductor plates 5 are adhered to the same surface with the external conductor plates 1 between the triplet lines and serve as the external conductor plates 1 of the triplet lines to be connected and internal conductor plates of triplet lines formed newly by utilizing the dielectric substrates 2.