Title:
HEAT SINK SUBSTRATE FOR MOUNTING ELECTRONIC PARTS ON BOTH SIDES
Document Type and Number:
Japanese Patent JPS5877300
Kind Code:
A
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Inventors:
OKAMOTO JIYUNICHI
SHIMADA KAZUYUKI
ISHIDA TOMIO
MATSUMOTO NOBUO
YAMAWAKI MOTONORI
SHIMADA KAZUYUKI
ISHIDA TOMIO
MATSUMOTO NOBUO
YAMAWAKI MOTONORI
Application Number:
JP17615281A
Publication Date:
May 10, 1983
Filing Date:
November 02, 1981
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K1/05; H01L23/36; H01L23/373; H05K1/02; H05K7/20; (IPC1-7): H01L23/36; H05K1/02; H05K7/20
Domestic Patent References:
| JPS55130195A | 1980-10-08 | |||
| JP55164865B |
Attorney, Agent or Firm:
Koji Hoshino