Title:
MANUFACTURE OF ELECTRIC AND ELECTRONIC COMPONENTS
Document Type and Number:
Japanese Patent JPS5892547
Kind Code:
A
Abstract:
PURPOSE: To obtain an epoxy resin composition with a limited shrinkage which hardens quickly in a metal mold with a higher stability in a screw of an injection molding machine by arranging a specified compound as a promoter.
CONSTITUTION: 100pts.wt. of epoxy resin is blended with 20W120pts.wt. of a phenol novolac resin and 0.1W20pts.wt. of a urea derivative as shown by the formula (Ar represents substituted or unsubstituted aryl group). It is preferable that the temperature in a cylinder or of a cylinder head is set 60W200°C. A molding withdrawn from the metal mold is post-cured at 100W200°C to obtain electric and electronic components with limited cracking and distortion after the hardening thereof.
Inventors:
TOMINAGA KAORU
SAKURABA TSUKASA
IWATA TADAO
SAKURABA TSUKASA
IWATA TADAO
Application Number:
JP19213481A
Publication Date:
June 01, 1983
Filing Date:
November 30, 1981
Export Citation:
Assignee:
MITSUI PETROCHEMICAL IND
International Classes:
B29C43/00; B29C45/00; B29C45/14; C08G59/00; C08G59/50; C08G59/62; C08G59/68; C08L63/00; H01L21/56; H01L23/29; H01L23/31; B29K63/00; (IPC1-7): B29G3/00; C08G59/62; C08G59/68; H01L21/56; H01L23/30
Attorney, Agent or Firm:
Inoue Masao