Title:
BONDING DEVICE
Document Type and Number:
Japanese Patent JPS59117226
Kind Code:
A
Abstract:
PURPOSE:To enable to perform the same bonding at least to the two sides of a work even when the work is put on a stage as it is by a method wherein the stage is constructed enabling a rotation in the height direction as to incline the stage surface. CONSTITUTION:Carrying in and carrying out of a work 13 are performed when a stage 14 is in the horizontal condition, and a flange 2 is carried out and carried in to the stage 14 according to a loader and unloader mechanism. When the flange 2 is put on the stage 14 and is fixed, a motor 23 is reversed, and the stage 14 is rotated to the left side to come to a standstill. A connecting side 26 to be fixed with a P-I-N diode chip 9 becomes horizontally in this condition, and a bonding tool 16 vacuum adsorbed with the chip 9 at the lower edge in a feed part is descended to fix the chip 9 on the connecting side 26 interposing a cementing material between them. At this time, an X-Y table 17 is transferred according to previously inputted informations as to position the connecting side 26 directly under the tool 16. After bonding is completed, the tool 16 is ascended and transferred, a laser diode chip 5 is vacuum adsorbed to the lower edge thereof in the feed part, and the tool comes to a standstill again at the fixed position.
Inventors:
FURUHASHI TAKAHIRO
YAZAKI NORIHIRO
ASAYAMA TAKASHI
TACHIBANA OSAMU
YAZAKI NORIHIRO
ASAYAMA TAKASHI
TACHIBANA OSAMU
Application Number:
JP22632482A
Publication Date:
July 06, 1984
Filing Date:
December 24, 1982
Export Citation:
Assignee:
HITACHI OME ELECTRONIC CO
HITACHI LTD
HITACHI ELECTR ENG
HITACHI LTD
HITACHI ELECTR ENG
International Classes:
H01L21/52; H01L21/60; (IPC1-7): H01L21/58
Domestic Patent References:
| JPS57106190A | 1982-07-01 |
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)