Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JPS5933255
Kind Code:
B2
Inventors:
KISHIKAWA KOICHIRO
Application Number:
JP8513977A
Publication Date:
August 14, 1984
Filing Date:
July 18, 1977
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L29/73; H01L21/312; H01L21/318; H01L21/322; H01L21/324; H01L21/331; (IPC1-7): H01L21/314; H01L21/265; H01L21/324
Attorney, Agent or Firm:
Inoue Kazuo