Title:
【考案の名称】半導体素子用セラミツクパツケ-ジ
Document Type and Number:
Japanese Patent JPS5984847
Kind Code:
U
Inventors:
Shozo Abe
Application Number:
JP18119482U
Publication Date:
June 08, 1984
Filing Date:
November 30, 1982
Export Citation:
International Classes:
H01L23/12; H01L23/02; H01L23/04; (IPC1-7): H01L23/12; H01L23/02
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