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Title:
【考案の名称】半導体整流器
Document Type and Number:
Japanese Patent JPS5987154
Kind Code:
U
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Inventors:
Akio Ishii
Tetsuo Ookurono
Application Number:
JP18209582U
Publication Date:
June 13, 1984
Filing Date:
December 01, 1982
Export Citation:
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International Classes:
H01L25/10; H01L25/04; (IPC1-7): H01L25/04



 
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