Title:
【考案の名称】半導体集積回路装置
Document Type and Number:
Japanese Patent JPS5999441
Kind Code:
U
Inventors:
Takao Harakawa
Application Number:
JP19502682U
Publication Date:
July 05, 1984
Filing Date:
December 24, 1982
Export Citation:
International Classes:
H01L21/66; (IPC1-7): H01L21/66