Title:
【考案の名称】リ-ドフレ-ム
Document Type and Number:
Japanese Patent JPS60106349
Kind Code:
U
More Like This:
JPH05144991 | SEMICONDUCTOR DEVICE |
JP2003197829 | SEMICONDUCTOR |
JP3167296 | RESIN-FORMED WIRING BOARD |
Inventors:
Kawabata
Application Number:
JP19809183U
Publication Date:
July 19, 1985
Filing Date:
December 22, 1983
Export Citation:
International Classes:
H01L23/50; H01L23/48; (IPC1-7): H01L23/48