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Title:
【考案の名称】半導体集積回路
Document Type and Number:
Japanese Patent JPS60113653
Kind Code:
U
Inventors:
Takamura Nishimura
Application Number:
JP18534084U
Publication Date:
August 01, 1985
Filing Date:
December 06, 1984
Export Citation:
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International Classes:
H02H7/20; H01L21/822; H01L27/04; H01L27/08; H01L29/06; H01L29/78; H03F1/00; (IPC1-7): H01L29/78; H01L27/04; H01L27/08; H01L29/06
Domestic Patent References:
JPS49123287U1974-10-22
JPS476920A



 
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