Title:
【考案の名称】半導体処理液の供給装置
Document Type and Number:
Japanese Patent JPS60148029
Kind Code:
U
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Inventors:
Mori Yuko
Hayasaka Chihiro
Hayasaka Chihiro
Application Number:
JP3706184U
Publication Date:
October 01, 1985
Filing Date:
March 15, 1984
Export Citation:
International Classes:
H01L21/30; B01J4/00; H01L21/027; (IPC1-7): B01J4/00; H01L21/30
Domestic Patent References:
| JPS5028635U | 1975-04-02 | |||
| JPS582425U | 1983-01-08 |