Title:
【考案の名称】半導体素子の強制空冷装置
Document Type and Number:
Japanese Patent JPS60181045
Kind Code:
U
Inventors:
Ryuichi Saga
Application Number:
JP6909184U
Publication Date:
December 02, 1985
Filing Date:
May 14, 1984
Export Citation:
International Classes:
H05K7/20; H01L23/46; H01L23/467; (IPC1-7): H01L23/46; H05K7/20
Domestic Patent References:
| JP55162954B | ||||
| JP56129751B | ||||
| JP58170845B |