Title:
【考案の名称】半導体材料の水切乾燥装置
Document Type and Number:
Japanese Patent JPS6042732
Kind Code:
U
Inventors:
Seiichiro Aigo
Application Number:
JP13477583U
Publication Date:
March 26, 1985
Filing Date:
August 31, 1983
Export Citation:
International Classes:
F26B5/08; H01L21/304; (IPC1-7): H01L21/304; F26B5/08