Document Type and Number:
Japanese Patent JPS6155255
Kind Code:
B2
Abstract:
PURPOSE:To remove the dispersion of temperature in the same chip by arranging soaking plates onto a semiconductor base body and a semiconductor layer. CONSTITUTION:In the figure, a numeral 1 is the semiconductor base body, at the one main surface 11 side thereof circuit elements 12, 13 are formed, 2 the semiconductor layer, at the one main surface 21 side thereof circuit elements 22, 23 are shaped, 3 the first insulating layer positioned between one main surface 11 of the semiconductor base body 1 and the other main surface 24 of the semiconductor layer 2, and 4 the second insulating layer formed onto one main surface 21 of the semiconductor layer 2. Heat generated from the semiconductor base body can be discharged efficiently to the outside because the soaking plate 71 mounted between the semiconductor base body and the semiconductor layer and the soaking plate 72 set up onto the second insulating layer 4 are connected by soaking members 8. The soaking plates fill the role of shielding to the device, and noise-resistant property can be improved.
Inventors:
AKYAMA NOBORU
MYAGAWA NOBUAKI
OKANO SADAO
IKEDA TAKAHIDE
MYAGAWA NOBUAKI
OKANO SADAO
IKEDA TAKAHIDE
Application Number:
JP19286881A
Publication Date:
November 27, 1986
Filing Date:
December 02, 1981
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/34; H01L21/3205; H01L23/433; H01L23/52; H01L27/00
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