Document Type and Number:
Japanese Patent JPS63151219
Kind Code:
U
More Like This:
WO/2005/080059 | NOZZLE ASSEMBLY FOR A SAW FOR SEMICONDUCTORS |
Application Number:
JP4183487U
Publication Date:
October 05, 1988
Filing Date:
March 20, 1987
Export Citation:
International Classes:
B23D59/02; (IPC1-7): B23D59/02