Japanese Patent JPS6315259

B2

Novel substituted 11-amino-undeca-4,8-dienal and 11-amino-undecanal aldehyde-derivatives of the formulae Ia (Ia) or Ib (Ib) +TR in which R1 to R6, Y and m are as defined in patent claim 1, and processes for their preparation are described. The compounds of the formulae Ia and Ib can be catalytically hydrogenated to novel 1,11-diaminoundecanes, which, in turn, can be used, for example, for the preparation of polycondensation products, in particular transparent polyamides, or as curing agents for epoxide resins.

JPH05226523	SEMICONDUCTOR DEVICE
JPS62227922	EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE
JP2751076	PROBLEM TO BE SOLVED: To form a photosensitive thermosetting resin composition and a solder resist pattern.

JOZEFU PAAIFUAA
DEIITERU RAINAA

JP13366779A

April 04, 1988

October 18, 1979

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CIBA GEIGY

C08G59/00; C07C67/00; C07C209/00; C07C209/40; C07C209/42; C07C209/52; C07C209/62; C07C211/09; C07C211/17; C07C211/25; C07C211/27; C07C211/29; C07C239/00; C07C241/00; C07C251/04; C07C251/16; C07C251/34; C07C251/52; C07C251/78; C07C251/80; C07C251/82; C07C281/06; C07C281/08; C07D225/00; C07D225/02; C07D225/04; C07D307/52; C07D333/06; C07D333/20; C08G59/50; C08G69/26

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