Document Type and Number:
Japanese Patent JPS6352341
Kind Code:
B2
Abstract:
Method of mounting an electronic part, which comprises the steps of coating a two-liquid adhesive (12) composed of a main agent and a separate curing accelerator using a dispenser containing a mixture (2) of the main ageny and the curing accelerator on the area of a printed circuit board (10) where the part is to be placed, placing the electronic part (3) on the area coated with the adhesive (12), thereafter heating or shining ultra-violet light thereon to cure the adhesive (12), thereby temporarily securing the part (13), and then soldering the part on. This enables the mounting of large-sized electronic parts.
Inventors:
GAASUKU UIRIAMU AREN
Application Number:
JP50079282A
Publication Date:
October 18, 1988
Filing Date:
January 11, 1982
Export Citation:
Assignee:
SMITHKLINE BECKMAN CORP
International Classes:
G01N33/48; C09J5/06; G01N27/447; H05K3/30