Document Type and Number:
Japanese Patent JPS6361567
Kind Code:
B2
Application Number:
JP19662482A
Publication Date:
November 29, 1988
Filing Date:
November 08, 1982
Export Citation:
International Classes:
F23N1/02; F23N3/08; F23N5/24
Previous Patent: A resin composition, a resin film and a semiconductor device, and its manufacturing method
Next Patent: JPS6361568
Next Patent: JPS6361568