Document Type and Number:
Japanese Patent JPS6364076
Kind Code:
B2
Abstract:
PURPOSE:To transmit heat generated by a semiconductor laser element efficiently over a heat sink by providing the heat sink with sections to be joined joining with at least two surfaces of a substrate constituting a semiconductor laser device. CONSTITUTION:A section to be joined 4 consisting of recessed section formed to the upper surface of a heat sink 2 in predetermined depth has a bottom 4a and three side-surfaces 4b-4d connected to the bottom 4a. The bottom of the substrate 1a of a semiconductor laser element 1 and three side surfaces except a side surface on the output end surface 1c side of a laser oscillation section 1b are joined with the bottom 4a and side surfaces 4b-4d of the section to be joined 4 by a joining material 3. Consequently, the temperature rise of the element 1 can be inhibited because the back and three side-surfaces of the element 1 are joined with the heat sink 2 and the heat sink 2 is joined up to a section in the vicinity of the oscillation section 1b. Accordingly, an output from a semiconductor laser device can be increased.
Application Number:
JP2473383A
Publication Date:
December 09, 1988
Filing Date:
February 18, 1983
Export Citation:
International Classes:
H01S5/00; H01L23/36; H01S5/02375; H01S5/024
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