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Document Type and Number:
Japanese Patent JPS6420734
Kind Code:
U
More Like This:
JP2002057246TAPE HAVING TRANSPLANTABLE CONDUCTIVE PATTERN AND USED FOR SEMICONDUCTOR PACKAGING PROCESS, AND MANUFACTURING METHOD THEREFOR
Application Number:
JP11576687U
Publication Date:
February 01, 1989
Filing Date:
July 27, 1987
Export Citation:
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International Classes:
H01L21/68; H01L21/78; (IPC1-7): H01L21/68; H01L21/78
Domestic Patent References:
JPS5444679U1979-03-27
JPS53135280A1978-11-25



 
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