ヒューズ回路および半導体集積回路装置

Title:

ヒューズ回路および半導体集積回路装置

Document Type and Number:

Japanese Patent JPWO2004102664

Kind Code:

A

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Inventors:

Toshiya Uchida
Kobayashi Hiroyuki

Application Number:

JP2003005962W

Publication Date:

November 25, 2004

Filing Date:

May 13, 2003

Export Citation:

Assignee:

富士通株式会社

International Classes:

G11C29/04; H01L21/82; H01L27/04; H01L21/822

Attorney, Agent or Firm:

土屋繁
西山雅也
青木篤
鶴田準一

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