Title:
溝配線を有する半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JPWO2005013356
Kind Code:
A
Inventors:
Munehiro Tada
Hiroto Otake
Wood Yoshihiro
Masayoshi Tagami
Hiroto Otake
Wood Yoshihiro
Masayoshi Tagami
Application Number:
JP2004010183W
Publication Date:
February 10, 2005
Filing Date:
July 16, 2004
Export Citation:
Assignee:
NEC Corp.
International Classes:
H01L21/768; H01L23/522; H01L21/3065
Attorney, Agent or Firm:
Minoru Kudo