Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JPWO2006117851
Kind Code:
A
Inventors:
East Masahiko
Koketsu 洋章
Koketsu 洋章
Application Number:
JP2005008056W
Publication Date:
November 09, 2006
Filing Date:
April 27, 2005
Export Citation:
Assignee:
Spansion Japan, Inc.
Spansion LLC
Spansion LLC
International Classes:
H01L27/10; H01L29/792; H01L21/8247; H01L29/788; H01L27/115
Attorney, Agent or Firm:
Teruo Yokoyama
Shuhei Katayama
Shuhei Katayama