Title:
ウエハのシリコン層の探傷装置及び探傷方法
Document Type and Number:
Japanese Patent JPWO2007135753
Kind Code:
A
Inventors:
Tsuneo Kobayashi
Sakaki Tetsuo
Tomohisa Shirasaka
Sakaki Tetsuo
Tomohisa Shirasaka
Application Number:
JP2006317462W
Publication Date:
November 29, 2007
Filing Date:
September 04, 2006
Export Citation:
Assignee:
Sakaki Tetsuo
International Classes:
G01N27/90
Attorney, Agent or Firm:
Kobayashi Ryohei