Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
円盤状の切削工具及び切削装置
Document Type and Number:
Japanese Patent JPWO2008047790
Kind Code:
A
More Like This:
JPS6067856[Title of the device] it does not carry out -- it is -- the segment type braid for reinforced plastic material cutting
JPH0539861[Name of device] Diamond tool
JP4293411Grinding wheel, grinding wheel manufacturing method, grinding wheel manufacturing device and grinding wheel holding device
Inventors:
Onishi Kazumasa
Application Number:
JP2007070162W
Publication Date:
April 24, 2008
Filing Date:
October 16, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Onishi Kazumasa
International Classes:
B24D5/12; B24D5/00; B24B1/04; B28D1/24
Attorney, Agent or Firm:
Yasuo Yanagawa



 
Previous Patent: 円盤状の切削工具及び切削装置

Next Patent: SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE