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Title:
モジュール部品とその製造方法
Document Type and Number:
Japanese Patent JPWO2011007519
Kind Code:
A1
Abstract:
モジュール部品は、半導体部品やチップ部品からなる電子部品が、回路基板に半田部を介して実装され、更に封止樹脂に覆われてなる。配線部と配線部の周囲部とのみを、ソルダーレジストで覆い、ソルダーレジストを更に封止樹脂で覆うことで、信頼性の高いモジュール部品を実現する。

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Inventors:
Nobuhiro Tada
Takafumi Kashiwagi
Yukio Sakai
Takayuki Hiruma
Application Number:
JP2011522703A
Publication Date:
December 20, 2012
Filing Date:
July 06, 2010
Export Citation:
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Assignee:
Panasonic Corporation
International Classes:
H01L23/12; H01L25/00; H05K3/28; H05K3/34
Domestic Patent References:
JP2004207352A2004-07-22
JPS6245094A1987-02-27
JP2007214230A2007-08-23
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii



 
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