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Title:
光半導体保護材及びその前駆体並びに光半導体保護材の製造方法
Document Type and Number:
Japanese Patent JPWO2011132589
Kind Code:
A
Inventors:
Akira Horai (1239, Aboshi-ku Shinzaike, Himeji-shi, Hyogo-ken Inside of a ダイセル, Inc. research institute)
Takahiro Iwahama (1239, Aboshi-ku Shinzaike, Himeji-shi, Hyogo-ken Inside of a ダイセル, Inc. research institute)
鄭 Takahiro (1239, Aboshi-ku Shinzaike, Himeji-shi, Hyogo-ken Inside of a ダイセル, Inc. research institute)
Ryuta Tomoyose (1239, Aboshi-ku Shinzaike, Himeji-shi, Hyogo-ken Inside of a ダイセル, Inc. research institute)
Application Number:
JP2011059217W
Publication Date:
July 18, 2013
Filing Date:
April 13, 2011
Export Citation:
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Assignee:
ダイセル, Inc. (3-4-5, Umeda, Kita-ku, Osaka-shi, Osaka)
International Classes:
C08G61/06; C08F232/00; C08L23/02; C08K5/5425; H01L31/042
Attorney, Agent or Firm:
Atsuo Kuwata
Hiroshi Sakanaka