Title:
半導体装置
Document Type and Number:
Japanese Patent JPWO2016203648
Kind Code:
A1
Abstract:
半導体装置は、第１のパッドに接続される第１の入出力回路と、第１の入出力回路に対しチップ端部が構成する１つの辺に沿う方向に配置され、第２のパッドに接続される第２の入出力回路と、第１および第２の入出力回路の外側のチップ端部の近傍に配置されるＥＳＤ保護回路と、を備える。ＥＳＤ保護回路は、抵抗と、容量と、インバータと、Ｎチャネル型トランジスタと、を備える。
Inventors:
Maeda Satoshi
Yasuyuki Morishita
Masanori Tanaka
Yasuyuki Morishita
Masanori Tanaka
Application Number:
JP2017524267A
Publication Date:
November 02, 2017
Filing Date:
June 19, 2015
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L21/822; H01L21/82; H01L27/04; H01L27/06
Domestic Patent References:
| JP2003031669A | 2003-01-31 | |||
| JP2012253266A | 2012-12-20 | |||
| JPH0689973A | 1994-03-29 | |||
| JP2013183107A | 2013-09-12 | |||
| JP2005536046A | 2005-11-24 | |||
| JP2003530698A | 2003-10-14 | |||
| JP2013021249A | 2013-01-31 |
Foreign References:
| WO2006011292A1 | 2006-02-02 | |||
| US6078068A | 2000-06-20 |
Attorney, Agent or Firm:
Polaire Patent Business Corporation
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