Document Type and Number:
Japanese Patent JPWO2021085378
Kind Code:
A1
Abstract:
Provided is a lid of an electronic component-housing package. The lid includes a conductor layer and a dielectric layer. The conductor layer includes at least one opening and a first part surrounding the at least one opening. The dielectric layer includes a second part, a first dielectric layer, and a second dielectric layer. The second part is located in the at least one opening. The first dielectric layer lies on the top of the conductor layer. The second part lies on the underside of the conductor layer.
Application Number:
JP2021553603A
Publication Date:
May 06, 2021
Filing Date:
October 26, 2020
Export Citation:
Domestic Patent References:
| JP2002231843A | 2002-08-16 | |||
| JP2017191835A | 2017-10-19 | |||
| JP2005051112A | 2005-02-24 | |||
| JP2008244475A | 2008-10-09 |
Foreign References:
| WO2006059556A1 | 2006-06-08 |