Document Type and Number:
Japanese Patent JPWO2021117548
Kind Code:
A1
Abstract:
In the present invention, a semiconductor element (19) is mounted on a ceramic substrate (5). The ceramic substrate (5) having the semiconductor element (19) mounted thereon is accommodated inside a case (13). A solution of a silane coupling agent is poured into the case (13). The solution inside the case (13) is removed. By carrying out a process on the solution adhered to the semiconductor element (19) and the like in the step in which the solution is poured into the case (13), a primer layer (35) is formed on the surface of the semiconductor element (19) and the like. By filling the inside of the case (13) with a sealing material (37), the semiconductor element (19) and the like having the primer layer (35) formed thereon are sealed.
Application Number:
JP2021563873A
Publication Date:
June 17, 2021
Filing Date:
December 01, 2020
Export Citation:
Domestic Patent References:
| JP2017183695A | 2017-10-05 | |||
| JP2013028713A | 2013-02-07 | |||
| JP6440794B1 | 2018-12-19 | |||
| JP2003181853A | 2003-07-02 | |||
| JP2017057339A | 2017-03-23 | |||
| JP2011159692A | 2011-08-18 |
Foreign References:
| WO2018185974A1 | 2018-10-11 | |||
| WO2014128899A1 | 2014-08-28 |