Document Type and Number:
Japanese Patent JPWO2022030115
Kind Code:
A1
Abstract:
Provided is a curable resin composition from which a cured article having excellent adhesion to a substrate, particularly a poorly-adhesive resin substrate, can be produced. This curable resin composition comprises (A) a curable resin, (B) an ethylenically unsaturated monomer, (C) an acidic surfactant, (D) an inorganic filler, (E) a thermal polymerization initiator, and optionally a saturated polybasic acid, in which the curable resin (A) comprises at least a vinyl ester resin, the acid value of a mixture of the curable resin (A), the ethylenically unsaturated monomer (B) and the saturated polybasic acid is 12 mgKOH/g or less, the acid value of a mixture of the curable resin (A), the ethylenically unsaturated monomer (B), the acidic surfactant (C) and the saturated polybasic acid is 10 mgKOH/g or more, and the acidic surfactant (C) is a low-volatile substance having an acid value of 20 mgKOH/g or more.
Application Number:
JP2022541139A
Publication Date:
February 10, 2022
Filing Date:
June 18, 2021
Export Citation:
