Document Type and Number:
Japanese Patent JPWO2022044802
Kind Code:
A1
Abstract:
A wire drawing die 1 includes a non-diamond material, is provided with a die hole 1h, and has a reduction 1c and a bearing 1d that is positioned downstream of the reduction 1c. A reduction angle γ which is an opening angle of the die hole 1h at the reduction 1c is less than or equal to 17°, and a surface roughness Ra of the die hole 1h within ±20 µm from a specific position inside the bearing 1d in a circumferential direction of the die hole 1h that is perpendicular to a wire drawing direction is less than or equal to 0.025 µm.
Application Number:
JP2022545628A
Publication Date:
March 03, 2022
Filing Date:
August 11, 2021
Export Citation:
