Document Type and Number:
Japanese Patent JPWO2022075370
Kind Code:
A1
Abstract:
The present invention discloses an adhesive film for circuit connection. The adhesive film for circuit connection is provided with: a first region containing conductive particles and a first adhesive component; and a second region containing a second adhesive component provided adjacent to the first region. At least one of the first adhesive component and the second adhesive agent component includes a monofunctional oxetane compound.
Application Number:
JP2022555537A
Publication Date:
April 14, 2022
Filing Date:
October 06, 2021
Export Citation:
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