Document Type and Number:
Japanese Patent JPWO2022097328
Kind Code:
A1
Abstract:
A resonance device that includes a MEMS substrate, a top cover, and a bonding part. The MEMS substrate includes a resonator. The bonding part is electrically conductive and bonds the MEMS substrate and the top cover to each other. The MEMS substrate further includes a wiring line layer and an anti-diffusion layer. The wiring line layer is electrically connected to a Si substrate serving as a lower electrode of the resonator. The anti-diffusion layer electrically connects the wiring line layer and the bonding part to each other.
Application Number:
JP2022560644A
Publication Date:
May 12, 2022
Filing Date:
July 02, 2021
Export Citation:
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