Document Type and Number:
Japanese Patent JPWO2022163481
Kind Code:
A1
Abstract:
An optical circuit board of the present disclosure includes a wiring board and an optical waveguide. The wiring board includes a mounting region for an optical component on an upper surface of the wiring board. The optical waveguide is located in a region adjacent to the mounting region, and includes, over the upper surface of the wiring board, a lower cladding layer, a plurality of cores extending in a first direction, and an upper cladding layer in this order, and is provided with alignment marks on the lower cladding layer. The lower cladding layer includes a first region in which the plurality of cores are located, and two second regions located facing the first region across a groove at positions between which the plurality of cores are sandwiched. The optical waveguide includes a first surface facing the mounting region, and end surfaces of the plurality of cores are exposed thereon.
Application Number:
JP2022578299A
Publication Date:
August 04, 2022
Filing Date:
January 20, 2022
Export Citation:
Previous Patent: JPWO2022163480
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