Document Type and Number:
Japanese Patent JPWO2022163610
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a photosensitive resin composition having excellent pattern processability and pressure resistance. The present invention is a photosensitive resin composition comprising (A) a polymer, (B) a radically polymerizable compound, (C) a photopolymerization initiator, and (D) an inorganic filler, wherein the radically polymerizable functional group equivalent of the (B) radically polymerizable compound is 70-200 g/eq on average.
Application Number:
JP2022510941A
Publication Date:
August 04, 2022
Filing Date:
January 25, 2022
Export Citation:
