Document Type and Number:
Japanese Patent JPWO2022168606
Kind Code:
A1
Abstract:
A semiconductor device includes: an electroconductive support including leads; a first semiconductor element supported by the support; a second semiconductor element supported by the support; a third semiconductor element supported by the support, electrically connected to the first and the second semiconductor elements, and insulating the first and the second semiconductor elements from each other; and a sealing resin covering the first, the second and the third semiconductor elements and a part of the support. The support includes: a first part overlapping with the first semiconductor element as viewed in a thickness direction of the leads; a second part overlapping with the second semiconductor element as viewed in the thickness direction; and a third part overlapping with the third semiconductor element as viewed in the thickness direction. The third part is made of a non-magnetic material having a relative permeability of less than 100.
Application Number:
JP2022579428A
Publication Date:
August 11, 2022
Filing Date:
January 19, 2022
Export Citation:
