Document Type and Number:
Japanese Patent JPWO2022176777
Kind Code:
A1
Abstract:
A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 µm or more and 150 µm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.
Application Number:
JP2023500804A
Publication Date:
August 25, 2022
Filing Date:
February 10, 2022
Export Citation:
