Document Type and Number:
Japanese Patent JPWO2023021704
Kind Code:
A1
Abstract:
This semiconductor device comprises a board and a plurality of semiconductor elements. Each semiconductor element has first and second terminals and an internal wiring that connects the first and second terminals to each other. The first terminal of each semiconductor element is connected to the second terminal of respective one of the other semiconductor elements via a board wiring provided in the board, thereby providing a wiring path that establishes a sequential connection between the plurality of semiconductor elements. One of the plurality of semiconductor elements has a determination circuit that is located on the path of the internal wiring. The determination circuit transmits a determination signal to the first terminal and determines an abnormality of the wiring path on the basis of the determination signal received by the second terminal via the wiring path. In this way, poor connection of the plurality of semiconductor elements can be detected with the increase of cost suppressed.
Application Number:
JP2023542168A
Publication Date:
February 23, 2023
Filing Date:
August 20, 2021
Export Citation:
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