Title:
CIRCUIT SUBSTRATE CONNECTION STRUCTURE AND CIRCUIT SUBSTRATE CONNECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2006/126586
Kind Code:
A1
Abstract:
There are provided a circuit substrate connection structure and a circuit substrate connection method capable of enlarging the area where electronic parts can be mounted and simplifying the production procedure. The circuit substrate connection structure (30) includes a rear surface circuit pattern (43) (see Fig. 3) arranged on the rear surface (32B) of a first circuit substrate (31) and a first electronic part (45) and a second electronic part (46) mounted on the rear surface circuit pattern (43). According to the circuit substrate connection method, the first and the second circuit substrate (31, 35) are connected by arranging a pressurizing jig (55) having a first and a second contact surface (56, 57) in contact respectively with apexes (45A, 46A) of the first electronic part (45) and the second electronic part (46) and a receiving surface (58) in contact with a reception base (51) and parallel to the first circuit substrate (31), between the apexes (45A, 46A) of the first electronic part (45) and the second electronic part (46) and the reception base (51).
Inventors:
SUZUKI HIROYUKI
Application Number:
PCT/JP2006/310351
Publication Date:
November 30, 2006
Filing Date:
May 24, 2006
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
SUZUKI HIROYUKI
SUZUKI HIROYUKI
International Classes:
H05K1/14; H01L21/60; H01L25/16; H05K3/36
Foreign References:
| JPH0766518A | 1995-03-10 | |||
| JPH10150253A | 1998-06-02 | |||
| JPH11163475A | 1999-06-18 | |||
| JP2004287220A | 2004-10-14 |
Attorney, Agent or Firm:
Takamatsu, Takeshi (7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, JP)
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