CURABLE RESIN COMPOSITION - KONISHI CO LTD

Title:

CURABLE RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2010/008079

Kind Code:

A1

Abstract:

Disclosed is a curable resin composition with reduced environmental burden, which is safe and has a sufficient curing rate. The composition contains a curable resin (A) having a hydrolyzable silicon group (1) in each molecule, a curable resin (B) having a hydrolyzable silicon group (2) in each molecule, and at least one kind of aminosilane compound (C) which is a compound (3), a condensation product of the compound (3) by itself or a condensation product of the compound (3) and another silane compound, at a specific ratio. -X-SiR1 a(OR2)3-a (1) -A-CH2-SiR3 b(OR4)3-b (2) R5R6N-R7-SiR8 c(OR9)3-c (3) (In the formulae, X represents a hydrocarbon group having 2 or more carbon atoms; A represents a bonding functional group wherein a heteroatom having an unshared electron pair is bonded to CH2 which is bonded to Si contained in the hydrolyzable silicon group; R1, R2, R3, R4, R8 and R9 each represents an alkyl group having 1-20 carbon atoms; R5 and R6 each represents an organic group or a hydrogen atom; R7 represents an organic group wherein a heteroatom is not bonded to C which is bonded to a hydrolyzable silicon atom; and a, b, c each represents 0, 1 or 2.)

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WO/2011/090046	CURABLE RESIN COMPOSITION

Inventors:

KUSUNOKI KOUJI
INUI JUN
NOMURA YUKIHIRO
SUGIYAMA SHIGEKI
SATO SHINICHI

Application Number:

PCT/JP2009/062994

Publication Date:

January 21, 2010

Filing Date:

July 17, 2009

Export Citation:

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Assignee:

KONISHI CO LTD (JP)
KUSUNOKI KOUJI
INUI JUN
NOMURA YUKIHIRO
SUGIYAMA SHIGEKI
SATO SHINICHI

International Classes:

C08L101/10; C08K5/544; C08K5/57; C08L33/04; C08L71/02; C09J171/02; C09K3/10

Foreign References:

JP2005535779A	2005-11-24
JP2005514504A	2005-05-19
JP2005501146A	2005-01-13