CUTTER AND METHOD FOR CUTTING BRITTLE MATERIAL SUBSTRATE USING SAME

Title:

CUTTER AND METHOD FOR CUTTING BRITTLE MATERIAL SUBSTRATE USING SAME

Document Type and Number:

WIPO Patent Application WO/2010/087423

Kind Code:

A1

Abstract:

Provided is a cutter which can reliably form a diagonal crack further in the direction of the thickness of a brittle material substrate. The cutter has a shape wherein the congruent bottom surfaces of the two circular cones or two circular truncated cones sharing a rotating axis (22) are bonded and the circumferential portion of the bottom surfaces is formed as a blade edge ridge line (21). On the blade edge ridge line (21), grooves (23) tilted by a predetermined angle with respect to the rotating axis direction are formed at predetermined intervals in the circumferential direction. Furthermore, angles (blade angle (θ1), blade angle (θ2)) formed by the side surfaces of the two circular cones or those of the circular truncated cones and the bottom surfaces are different from each other.

Inventors:

TOMINAGA KEISUKE (JP)
MAEKAWA KAZUYA (JP)

Application Number:

PCT/JP2010/051184

Publication Date:

August 05, 2010

Filing Date:

January 29, 2010

Export Citation:

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Assignee:

MITSUBOSHI DIAMOND IND CO LTD (JP)
TOMINAGA KEISUKE (JP)
MAEKAWA KAZUYA (JP)

International Classes:

C03B33/10; B28D1/24; B28D5/04; C03B33/04

Foreign References:

JP2000219527A	2000-08-08
JPH07223828A	1995-08-22
JPH09278474A	1997-10-28
FR2466441A1	1981-04-10
JPH07223828A	1995-08-22

Other References: