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Title:
1-D TIRE PATCH DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2014208534
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve durability of a tire patch, an associated supported device and a structure.SOLUTION: A tire fitting die device having a substrate defining a longitudinal direction and having a top face and a bottom face, and a tire fitting die method are disclosed. The substrate has plural conductor terminals arranged in a substantially linear state. A first support element is arranged below the bottom face of the substrate, and a second support element is arranged above the top face of the substrate. The plural conductor terminals are positioned between the first support element and the second support element. The substrate is preferably a piezoelectric type device having a piezoelectric layer disposed between a first conductive layer and a second conductive layer. The plural conductor terminals are preferably arranged in a substantially linear state along a line which is about 80-100° with respect to the longitudinal direction of the substrate, and the longitudinal direction of the substrate is substantially vertical to a rotation direction of a tire.

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Inventors:
DAVID ALAN WESTON
RAYMOND LESLIE HODGKINSON
Application Number:
JP2014153249A
Publication Date:
November 06, 2014
Filing Date:
July 28, 2014
Export Citation:
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Assignee:
MICHELIN RECH TECH
COMPANY GENERAL DE ETABLISMAN MICHELIN
International Classes:
B60C19/00; B60C23/04
Domestic Patent References:
JP2000314744A2000-11-14
JP2005525265A2005-08-25
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JPH02195223A1990-08-01
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Foreign References:
US20090205435A12009-08-20
WO2008017533A12008-02-14
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Attorney, Agent or Firm:
辻居 Koichi
Sadao Kumakura
Pupil circle 健
Sari Ino
Matsushita 満
Ichiro Kurasawa



 
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