Title:
ONE-PACK TYPE NORMAL TEMPERATURE MOISTURE-CURABLE ADHESIVE COMPOSITION FOR WOODY FLOOR MATERIAL
Document Type and Number:
Japanese Patent JP2016172826
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a one-pack type normal temperature moisture-curable adhesive composition which can reduce a joint gap of a floor material when used as an adhesive for a woody floor material.SOLUTION: There is provided a one-pack type normal temperature moisture-curable adhesive composition which comprises (A) an oxyalkylene-based polymer having a silicon containing group which has a hydroxyl group or a hydrolyzable group bonded to a silicon atom and is capable of crosslinking by forming a siloxane bond, (B) an imine derivative of a compound having a silicon-containing group which has a hydroxyl group or a hydrolyzable group bonded to a silicon atom and is capable of crosslinking by forming a siloxane bond and an amino group, (C) a tetravalent tin compound and (D) an epoxy compound having a crosslinkable silicon group.SELECTED DRAWING: Figure 1
Inventors:
NISHIMURA KANA
KANO SHINGO
TAKAHASHI MASAO
KANO SHINGO
TAKAHASHI MASAO
Application Number:
JP2015053787A
Publication Date:
September 29, 2016
Filing Date:
March 17, 2015
Export Citation:
Assignee:
CEMEDINE CO LTD
International Classes:
C09J183/12; C09J11/04; C09J11/06; C09J163/00; C09J171/02; E04F15/00
Domestic Patent References:
| JP2006143985A | 2006-06-08 | |||
| JP2011021107A | 2011-02-03 |
Foreign References:
| WO2014065076A1 | 2014-05-01 |
Attorney, Agent or Firm:
Shinsuke Ishihara
Shoji Ishihara
Shoji Ishihara