Title:
回路板用の3次元不織基板
Document Type and Number:
Japanese Patent JP2004528466
Kind Code:
A
Abstract:
The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (Printed Circuit Board) and similar application. By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.
Inventors:
Zukker, Jerry
Carter, Nick Mark
Carter, Nick Mark
Application Number:
JP2003501658A
Publication Date:
September 16, 2004
Filing Date:
June 04, 2002
Export Citation:
Assignee:
Polymer Group Incorporated
International Classes:
C08J5/04; B29B15/12; B29C70/12; B29C70/16; B29C70/36; B29C70/50; B32B5/24; D04H1/46; D04H1/48; D04H3/10; D04H5/02; D04H13/00; H05K1/02; H05K1/03; H05K1/00; H05K3/00; H05K3/10; (IPC1-7): C08J5/04; H05K1/03
Attorney, Agent or Firm:
Heikichi Odashima