Title:
三次元造形装置
Document Type and Number:
Japanese Patent JP7272091
Kind Code:
B2
Abstract:
Provided is a three-dimensional shaping device (100) including a melting unit (30) configured to melt a material into a shaping material, and a nozzle (61) configured to discharge the shaping material supplied from the melting unit (30) toward a stage. The melting unit (30) includes a screw (40) configured to rotate about a rotation axis (M) and having a groove forming surface in which a groove (45) to which the material is supplied is formed, a heating unit (58) configured to heat the material supplied to the groove (45), a barrel (50) having a facing surface (52) that faces the groove (45) forming surface (42) and provided with a communication hole (56) that communicates the facing surface (52) with the nozzle (61), and a discharge amount adjustment mechanism (70) provided in the communication hole (56) and configured to adjust a flow rate of the shaping material discharged from the nozzle (61).
Inventors:
Kenta Anekawa
Kohei Yuwaki
Yusuke Watanabe
Kohei Yuwaki
Yusuke Watanabe
Application Number:
JP2019082907A
Publication Date:
May 12, 2023
Filing Date:
April 24, 2019
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
B29C64/321; B22F10/18; B22F10/85; B22F12/13; B22F12/20; B22F12/50; B28B1/30; B29C64/118; B29C64/209; B29C64/295; B29C64/393; B33Y30/00; B33Y50/02
Domestic Patent References:
| JP2019038157A | ||||
| JP2017523934A | ||||
| JP2017035811A | ||||
| JP49010257A |
Foreign References:
| US20190061243 | ||||
| US20150321419 | ||||
| US4850839 |
Attorney, Agent or Firm:
Patent Attorney Corporation Meisei International Patent Office
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