To obtain a 4-methyl-1-pentane (P)-based resin composition, excellent in heat resistance, adhesive strength to a substrate, an extrusion lamination molding processability and capable of manifesting excellent mold releasability as a mold releasing layer and a laminate comprising a resin composition layer laminated to a paper substrate or a metallic substrate such as an aluminum foil.

This composition comprises (A) 30-95 pts.wt. P-based polymer having a melt flow rate(MFR) (at 260°C temperature under 5.0kg load) within the range of 1-400g/10min, (B) 2-30 pts.wt. high-pressure-produced low-density polyethylene having the MFR within the range of 0.1-100g/10min, (C) 0.1-20 pts.wt. modified α-olefin-based polymer graft modified with an unsaturated carboxylic acid or its derivative in a grafting amount within the range of 0.01-10wt.% and (D) 2-55 pts.wt. copolymer, having 1-100g/10min MFR and comprising ethylene and at least one monomer selected from the group consisting of (meth)acrylic acid, an acrylic or a methacrylic ester and a metallic (meth) acrylate.