Title:
PHENOLIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3176808
Kind Code:
B2
Abstract:
PURPOSE: To obtain a phenolic resin composition excellent in heat resistance and toughness, capable of obtaining products having both high heat resistance and toughness if used, e.g. as a raw material for molding materials, an organic fiber binder, rubber formulation, whetstone binder, inorganic fiber binder, electrical/electronic part coating agent, resin for laminates, sliding member binder.
CONSTITUTION: This composition comprises a phenolic resin and 2-50wt.% of an ethylene-acrylic ester copolymer elastomer.
Inventors:
Yoshiya Sumiyama
Application Number:
JP24559694A
Publication Date:
June 18, 2001
Filing Date:
October 11, 1994
Export Citation:
Assignee:
Sumitomo Durez Co., Ltd.
International Classes:
C08L61/06; C08L61/04; (IPC1-7): C08L61/06
Domestic Patent References:
| JP665471A | ||||
| JP5339444A | ||||
| JP5339378A | ||||
| JP59207960A |