Title:
レーザ加工装置の収差制御方法
Document Type and Number:
Japanese Patent JP7397317
Kind Code:
B2
Abstract:
To provide a laser processing apparatus and a laser processing method with which a laser processing region to be a cutting starting point can be efficiently formed with high accuracy, by suppressing an influence of aberration.SOLUTION: Provided is a laser processing apparatus which forms a laser processing region inside a workpiece according to irradiation of a laser beam with a converging point focused on the inside of the workpiece. The laser processing apparatus comprises: a spatial light modulator 24 for modulating a laser beam; a processing lens 26 for converging the laser beam modulated by the spatial light modulator 24 inside the workpiece; and a both-side telecentric relay optical system 30 including a first lens 36a and a second lens 36b, and disposed on an optical path between the spatial light modulator 24 and the processing lens 26. The spatial light modulator 24 and a lens pupil 26a of the processing lens 26 have an optically conjugated relationship, and a distance between the second lens and the lens pupil is longer than a focal distance of the second lens.SELECTED DRAWING: Figure 6
Inventors:
Kazushi Momomura
Application Number:
JP2020071589A
Publication Date:
December 13, 2023
Filing Date:
April 13, 2020
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B23K26/064; H01L21/301
Domestic Patent References:
| JP2012081522A | ||||
| JP2010102745A | ||||
| JP2016010809A |
Attorney, Agent or Firm:
Kenzo Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura