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Patent Searching and Data


Title:
研磨用物品およびその形成方法
Document Type and Number:
Japanese Patent JP7186770
Kind Code:
B2
Abstract:
An abrasive article includes an abrasive body having a bond material, abrasive particles contained within the bond material, and an electronic assembly coupled to the abrasive body, wherein the electronic assembly comprises at least one electronic device. In an embodiment, the electronic assembly is coupled to the abrasive body in a tamper-proof manner.

Inventors:
Jayaram, Robin Chandras
Sangamany, Arumbel
Haralur Gullingamur TM.
Application Number:
JP2020519388A
Publication Date:
December 09, 2022
Filing Date:
October 04, 2018
Export Citation:
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Assignee:
Saint-Gobain Abrasives, Incorporated
Saint-Gobain Abrajif
International Classes:
B24D7/00; B24B37/20; B24D3/02; B24D11/00
Domestic Patent References:
JP2008221460A
JP2009542449A
JP2005291999A
JP2017518887A
JP2013082051A
JP2000079565A
JP2005316580A
JP4109550U
JP2003192769A
Attorney, Agent or Firm:
Patent Attorney Corporation Otsuka International Patent Office
Yasunori Otsuka
Yasuhiro Otsuka
Shiro Takayanagi
Shuji Kimura
Osamu Shimoyama
Nagakawa Yumitsu
Tomofumi Kinoshita
Patent Attorney Corporation Asamura Patent Office